| Qualitel
is equipped and staffed to provide a wide array of assembly
capabilities ranging from highly automated to purely manual.
We constantly add new capabilities to support customer
requirements. All manufacturing employees are
certified with IPC-A-610-D from an outside trainer and all
soldering employees are certified to J-STD-001.
Ball Grid Arrays (BGA)
Our extensive processes and equipment capability
ensures that we will do BGA correctly. In addition,
Qualitel has 2 X-RAY stations and 2 BGA rework stations to
help with this process.
Surface Mount Technology (SMT)/Fine Pitch
Technology
Qualitel runs multiple SMT pick & place lines
with high speed chip, fine pitch QFP and BGA placement and
solder reflow capabilities. All SMT components are
loaded onto machine using barcode and smart feeder
system. In-house x-ray inspection equipment
provides critical process verification.
Through Hole
Our skilled workforce produces a large volume of
manual through-hole assembly each day, ranging from simple
component loading and wave soldering to complex secondary
assembly operations.
Lead Free ROHS
Processes
Qualitel has already implemented Lead-Free
processes for some of our key customers including a major
medical customers for SMT and other soldering processes.
Cables and Harnesses
Cable and harness assemblies are an important
part of our capabilities. Whatever type of interconnection
you need in your products, we can help.
Box Build
If you want your entire product assembled, Qualitel
is your best choice for box build assembly services.
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